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PCB Assembly Resource

What Files Are Needed for PCB Assembly? Gerber, BOM and CPL Explained

Prepare a complete manufacturing package that identifies the board, components, placement, assembly notes and verification requirements.

PCB assembly manufacturing package with board, Gerber layers, BOM and assembly drawings
Illustrative technical editorial visual; not evidence of Cyrionix-owned facilities or equipment.

A PCB assembly package normally includes PCB fabrication data, a bill of materials, a component placement file, assembly drawings and any programming or test instructions. The exact format can vary, but every file should describe the same released revision. Missing part numbers, DNP conflicts and mismatched designators are common reasons a useful quotation is delayed.

Core file set

FilePurposeCheck before sending
Gerber and drill filesDefine copper, mask, legend, outline and drilled features for fabricationInclude all required layers, board outline and matching drill data
BOMIdentifies placed parts and purchasing requirementsUse exact MPNs, references, quantities, DNP and approved alternatives
CPL / centroid / position fileLists component coordinates, rotation and board side for placementConfirm units, origin, side and excluded footprints
Assembly drawingClarifies polarity, orientation, DNP and special handlingMatch designators and revision to BOM and placement data
Programming packageDefines firmware and loading methodInclude files, version, interface and verification step
Test instructionsDefines expected behavior and acceptanceProvide fixtures, connections, sequence and pass limits

Revision-consistency check

  • File names or notes identify the released revision.
  • BOM and CPL reference designators use the same set.
  • DNP parts are treated consistently across BOM, CPL and drawings.
  • Board side and rotation conventions are confirmed.
  • Panel data and single-board data are not mixed without explanation.
  • Firmware and test instructions identify the intended hardware revision.

What official EDA documentation confirms

KiCad documents Gerber generation under Fabrication Outputs and explains that component placement files list footprint center positions and orientations for pick-and-place use. It also provides a Bill of Materials output. Your manufacturer may have additional naming and format requirements, so confirm the required package before release.

Useful RFQ context beyond files

  • Prototype and follow-on quantities
  • Consigned versus supplier-purchased parts
  • Delivery country
  • Target manufacturing and arrival dates
  • Required standards or traceability
  • Inspection, programming and test scope

KiCad 10 manufacturing package: export and verify

KiCad can generate the fabrication and placement outputs, but an export is not a released package until the team verifies revision, variant, orientation, DNP state and assembly instructions against the same baseline.

OutputUseVerification before release
Gerber and drillBoard image and drilled featuresLayer set, units, origin, apertures, drill pairs and plotted revision
Gerber job / stack-up notesTransfers board contextConfirm the selected fabricator accepts and interprets the data; do not rely on file presence alone
BOMPart identity and fitted quantityExact MPN, variant/DNP state, quantity and approved-source rules
Position filePick-and-place coordinates and rotationOrigin, top/bottom convention, centroid, rotation and polarized orientation
Assembly drawingHuman-readable intentPin 1, polarity, DNP, special handling and both board sides
IPC-D-356 netlistSupports bare-board checksExported from the released board and requested/accepted by the fabricator

Release record: save a manifest with filename, revision, export date, source tool/version and approval owner. Compare generated files with the native design before transmitting them.

Continue your project planning

Use the related service and resource pages to turn this guidance into a reviewable manufacturing request.

Related decision guides

Use these focused resources before releasing the next assembly package.